Such performance is obtained with only 19.2 kPa of pressure drop and 9.4 ml/min of flow rate, corresponding to a hydraulic power of only 3 mW and a coefficient of performance of 6 500. A thermal resistance of 2.8 ☌/W is achieved at a heat flux of 812 W/cm2 per heat source, for a total dissipated power of 20 W and a maximum allowed temperature rise of 55 ☌. It also proposes a confinement-wise metric. This work experimentally investigates the cooling performance of a non-invasive and hot spot aware microchannel die that is in direct fluidic contact with the backside of the microelectronic chip. Microchannels etched in the backside of the chip, usually considered as an efficient cooling solution, are impracticable on highly thinned chips.
In compact devices, heat must be removed using limited pumping power and cooling space. In microelectronics, approaches such as die thinning induce acute stress on cooling because it increases the hot spot phenomena and reduces chip bulk thickness that could be used for microchannels. This work demonstrates an experimental microchannel solution to cool microelectronic chips with hot spots, using an integrated, yet non-intrusive technique. We evaluate ChargeCache on a wide variety of workloads and show that it provides significant performance and energy benefits for both single-core and multi-core systems. Row addresses are removed from the table after a specified duration to ensure rows that have leaked too much charge are not accessed with lower latency. If a later DRAM request hits in that table, the memory controller uses lower timing parameters, leading to reduced DRAM latency.
To exploit this observation, we propose to track the addresses of recently-accessed rows in a table in the memory controller. Our mechanism is based on the key observation that a recently-accessed row has more charge and thus the following access to the same row can be performed faster. In this thesis, we develop a low-cost mechanism, called ChargeCache, which enables faster access to recently-accessed rows in DRAM, with no modifications to DRAM chips. DRAM-based memory is a critical factor that creates a bottleneck on the system performance since the processor speed largely outperforms the DRAM latency.
0 kommentar(er)
